SiliCool was established in December 2018. With independent R&D centers in Zhuhai, Hong Kong, Suzhou, and Chengdu, the company's team is primarily composed of experienced professionals from renowned semiconductor equipment companies such as ASM, AMAT, as well as high-tech companies like Google and Amazon. Possessing industry-leading motion control technology and core algorithm platforms, the team is dedicated to developing equipment for high-speed, high-precision semiconductor chip packaging and multi-degree-of-freedom packaging of optical components.
Job Responsibilities:
Proficient in the operation of hardware equipments, software functions, and electrical layout
Capable of independently handling client equipment anomaly issues, machine debugging, and product switching
Familiar with the manufacturing process of client products and able to independently complete product demos for clients
Possesses strong abnormal analysis skills and can conduct root cause analysis and resolution of client anomaly issues
Equipped with report writing skills to summarize existing problems and share experiences
Possesses strong communication skills and can effectively communicate with client technicians
Trains client technicians to ensure they can complete equipment debugging, switching, and troubleshooting
Regularly provides client feedback to department supervisors
Qualifications:
Bachelor's degree or above in electronics, mechanics, industrial automation, or related fields
Familiar with mechanical structures, can independently handle equipment failures, and has electrical knowledge
Prior experience with die bonding equipment is preferred
Responsible, strong learning ability, excellent team spirit, and passionate about work
Able to business travel
